The 2024 Conference Program is available here!

2025 Technical Invited Talks

The technical program will be complemented by Invited Presentations from both industry and academia.

• Dr. Alessandro Calderoni, Micron Technology Inc.
  NVDRAM/Ferroelectric technology
• Prof. Andrew Kummel, U.C. San Diego
  Key Interface Chemistry and Engineering in Hybrid Bonding for 3D Packaging
• Prof. Paul McIntyre, Stanford U.
  Structure-Property Relations in Indium Tungsten Oxide Semiconductors for BEOL-Compatible Transistor Channels
• Dr. Brian Douglas Rummel, Sandia National Lab
  A self-consistent framework for wide-bandgap MOS CV analysis
• Prof. Sayeef Salahuddin, U.C. Berkeley
  Is it possible to push down the supply voltage of CMOS to 300 mV?
• Prof. Hitoshi Wakabayashi, Institute of Science Tokyo, Japan
  Gate stacks and underlaying dielectric film for 2D materials and devices
• Dr. Ernest Wu, IBM (Retired)
  Decades of Research Later: What We Know and What We Do Not Know About Dielectric Breakdown

Wednesday Evening Tutorial

The Wed Tutorial will shed light on a single topic in depth, particularly benefiting students and newcomers to the field.

• Prof. Anthony Yen, ASML
  Photolithography for Semiconductor Manufacturing: 65 Years and Going Strong

Past SISC programs are available here.