IEEE SISC

P. Ye General Chair Purdue U. IN, USA pye@ieeesisc.org
J. Rozen Technical Program Chair IBM NY, USA jrozen@ieeesisc.org	J. Franco Arrangements Chair imec Leuven, Belgium jfranco@ieeesisc.org
W. Vandenberghe Ex-Officio UT Dallas TX, USA wvandenberghe@ieeesisc.org

2023 Technical Program Committee

D. Chen, ASU, USA
J. Coignus, CEA/LETI, France
X. Gong, National U. of Singapore, Singapore
C. L. Hinkle, Notre Dame U., USA
D. Jena, Cornell U., USA
A. Khan, Georgia Tech, USA
E. Lind, Lund U., Sweden
C. Liu, National Taiwan U., Taiwan
S. Migita, AIST, Japan
M. Passlack, TSMC, USA
R. Pillarisetty, Intel, USA
J. Robertson, Cambridge U., UK
T. Roy, Duke U., USA
R. Timm, Lund U., Sweden
W. Tsai, Stanford U., USA
Y. Wu, PKU, China
C. Yang, Applied Materials, USA